NameImaxQmaxUmaxdTmaxRABCDH
(A)(W)(V)(K)(Ohm)(mm)(mm)(mm)(mm)(mm)
TB-35-0.6-0.82.15.44.3681.71266122.55

  产 品 说 明                                                                                                                        

微热电制冷器

 微型热电致冷器的主要应用:
微波技术--高灵敏度接收器和放大器的输入级冷却
参量法大器的热稳定
光电子学--半导体激光器,红外探测器,CCD矩阵的接触冷却
光电倍增管制冷调节器
特殊计算机工程--微处理器的热电致冷冷却器
  
技术特征: 我们也提供把微型热电致冷器安装或直接集成进标准的TO      

 (TO3, TO8
),HHL, DIL,butterfly或特殊装置内.

A universal abbreviation is used to notate single-stage coolers: ТВ-N-C-h, where:

ТВ — product contraction— thermoelectric battery (cooler);

N — number of thermocouples in the cooler;

С — length of the rib of the thermoelectric element basis (in millimeters);

h — height of the thermoelectric element (in millimeters)

 

For example, in the module ТВ-109-0.6-0.8: 109 thermocouples (218 thermoelectric elements), every element has the cross-section of 0.6×0.6 mm and is 0.8 mm high.


STANDARD TERMS OF DELIVERY:

 

— substrate material — alumina (ВК-96)

— height tolerance ± 0,15 mm

— parallelism 0,15 mm

— cable length 50 mm

— pin orientation (for rectangular coolers) — to the longer side

— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)

 

ADDITIONAL OPTIONS

Description

Notation (*)

Note

processing temperature up to 120 °C, max assembly temperature = 130 °C 

HT(120)

assembly solder with Tm = 139 °C 
processing temperature up to 150 °C, max assembly temperature = 170 °C 

HT(150)

assembly solder Pb-Sn with Tm = 183 °C 
processing temperature up to 200 °C, max assembly temperature = 220 °C 

HT(200)

assembly solder with Tm = 232 °C
height tolerance = ± 0.05 mm and parallelism 0.03 mm

L1


height tolerance = ± 0.025 mm and parallelism 0.02 mm

L2


metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C)

mc95, mh95, mm117 etc.


gold plating

mcAu, mhAu, mmAu

metallization Cu-Ni-Au (0.2-1 micron)
substrate material – aluminium nitride (AlN)

N

heat conductivity > 180 W/mK
sealant: epoxy, silicon, urethane, conformal coating

E, S, U, Сс


non-standard pin orientation

type and length of wires by customer’s requirement

soldering on cold or hot heatsink, packaging or cold block