Name | Imax | Qmax | Umax | dTmax | R | A | B | C | D | H |
(A) | (W) | (V) | (K) | (Ohm) | (mm) | (mm) | (mm) | (mm) | (mm) | |
TB-7-0.6-1.2 | 1.4 | 0.7 | 0.9 | 69 | 0.51 | 4.3 | 4.3 | 4.3 | 4.3 | 2.95 |
产 品 说 明
微热电制冷器
微型热电致冷器的主要应用:
* 微波技术--高灵敏度接收器和放大器的输入级冷却
* 参量法大器的热稳定
* 光电子学--半导体激光器,红外探测器,CCD矩阵的接触冷却
* 光电倍增管制冷调节器
* 特殊计算机工程--微处理器的热电致冷冷却器
技术特征: 我们也提供把微型热电致冷器安装或直接集成进标准的TO
(TO3, TO8等),HHL, DIL,butterfly或特殊装置内.
A universal abbreviation is used to notate single-stage coolers: ТВ-N-C-h, where:
ТВ — product contraction— thermoelectric battery (cooler);
N — number of thermocouples in the cooler;
С — length of the rib of the thermoelectric element basis (in millimeters);
h — height of the thermoelectric element (in millimeters)
For example, in the module ТВ-109-0.6-0.8: 109 thermocouples (218 thermoelectric elements), every element has the cross-section of 0.6×0.6 mm and is 0.8 mm high.
STANDARD TERMS OF DELIVERY:
— substrate material — alumina (ВК-96)
— height tolerance ± 0,15 mm
— parallelism 0,15 mm
— cable length 50 mm
— pin orientation (for rectangular coolers) — to the longer side
— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)
ADDITIONAL OPTIONS
Description | Notation (*) | Note |
processing temperature up to 120 °C, max assembly temperature = 130 °C | HT(120) | assembly solder with Tm = 139 °C |
processing temperature up to 150 °C, max assembly temperature = 170 °C | HT(150) | assembly solder Pb-Sn with Tm = 183 °C |
processing temperature up to 200 °C, max assembly temperature = 220 °C | HT(200) | assembly solder with Tm = 232 °C |
height tolerance = ± 0.05 mm and parallelism 0.03 mm | L1 | |
height tolerance = ± 0.025 mm and parallelism 0.02 mm | L2 | |
metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C) | mc95, mh95, mm117 etc. | |
gold plating | mcAu, mhAu, mmAu | metallization Cu-Ni-Au (0.2-1 micron) |
substrate material – aluminium nitride (AlN) | N | heat conductivity > 180 W/mK |
sealant: epoxy, silicon, urethane, conformal coating | E, S, U, Сс | |
non-standard pin orientation | ||
type and length of wires by customer’s requirement | ||
soldering on cold or hot heatsink, packaging or cold block |